LOCTITE® ABLESTIK 2112 BIPAX
Omadused ja eelised
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive
LOCTITE® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications.
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Tehniline teave
| Komponentide arv | 2-komponentne |
| Kõvenemisaeg, Soovitatav @ 65.0 °C | 4.0 tund |
| Nihkejõud, Alumiinium | 1900.0 psi |
| Soovitatav kasutada koos | Metall |
| Säilitustemperatuur | 27.0 °C |
| Tahkumistüüp | Kuumkõvenemine |
| Tiksotroopne indeks | 6.5 |
| Viskoossus, Brookfield, Spindle RV7, Speed 10 rpm | 60000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 2112 BIPAX
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive