BERGQUIST® GAP PAD® TGP HC1000

Known as Gap Pad® HC1000

Features and Benefits

BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material
BERGQUIST® GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material.
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Technical Information

Carrier type Fiberglass
Color Gray
Flame rating V-0
Operating temperature -60.0 - 200.0 °C
Standard thickness 0.254 - 0.508 mm
Thermal conductivity 0.1 W/mK
Young's modulus, ASTM D575 275.0 KPa (40.0 psi )

Frequently Asked Questions