LOCTITE® ECCOBOND UF 3811
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This halogen free, reworkable, low-viscosity underfill encapsulant is specially formulated to flow at room temperature: no additional preheating required.
LOCTITE® ECCOBOND UF 3811 is a reworkable, low-viscosity epoxy underfill specially designed for CSP and BGA applications. It flows at room temperature with no additional preheating required, and cures quickly at moderate temperatures to minimize stress to other components. When cured, it has a high glass transition temperature while maintaining flexibility, so solder joints are protected during thermal cycling and drop testing.
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Información técnica
| Coeficiente de dilatación térmica (CDT), Above Tg | 190.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Below Tg | 61.0 ppm/°C |
| Programa de curado, @ 100.0 °C | 60.0 min |
| Temperatura de transición vítrea (Tg) | 124.0 °C |
| Viscosidad, Brookfield, Physica @ 25.0 °C Spindle CP50-1, Speed 20 rpm | 354.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3811
This halogen free, reworkable, low-viscosity underfill encapsulant is specially formulated to flow at room temperature: no additional preheating required.