LOCTITE® ECCOBOND EN 3839

Features and Benefits

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LOCTITE ECCOBOND EN 3839, Acrylic, Encapsulant, Glob top
LOCTITE® ECCOBOND EN 3839 is specially designed for encapsulating components on PCB applications. When cured, this material provides physical protection, as well as, protection in temperature/humidity/bias testing.
  • Provides physical and electrical protection and stable electronic performance in temperature/humidity/bias testing
  • UV/ heat curable
  • Flexible, low Tg material for encapsulating components on a circuit board
  • Thixotropic
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Documents and Downloads

Technical Data Sheet
LOCTITE® ECCOBOND EN 3839
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Technical Information

Applications Encapsulating
Coefficient of thermal expansion (CTE), Above Tg 211.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 108.0 ppm/°C
Color Light blue
Cure schedule light intensity 2000.0 mJ/cm²
Cure schedule, @ 130.0 °C 10.0 min.
Cure type UV cure
Glass transition temperature (Tg) 26.0 °C
Shelf life 180.0 day
Shore hardness, Shore D 27.0
Storage modulus, DMA @ 25.0 °C 334.0 N/mm² (48400.0 psi )
Storage temperature -20.0 °C
Thixotropic index 4.1
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 7800.0 mPa·s (cP)