Power Supplies

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Getting power where it’s needed, when it’s needed and in the most cost-effective and sustainable way possible is the challenge for developers of today’s energy systems. Exponentially increasing function without increasing the size or weight of power supplies is driving power densities higher, even as markets demand greater reliability and low cost-of-ownership.

As critical components of any electronic system, power supplies/converters are essential, and their dependability is often mission-critical. As part of a holistic design strategy, Henkel’s award-winning thermal management solutions, protective materials and structural adhesives are helping power supply specialists meet demanding criteria.

Explore Applications

Solutions for AC/DC Power Supplies

AC/DC power supplies, designed to convert AC transmission voltages to DC voltage for use by end applications, distribution systems, and alternative energy devices, are seeing substantive improvements in design and capability made possible by high-performance electronic materials. The capability enabled by advanced adhesives and thermal management solutions help make these important electronic systems smaller, more portable, increasingly powerful, and highly reliable.

Solutions for DC/DC Converters

Designed to convert DC transmission voltages to DC voltage for use by end applications including battery backup systems, DC/DC power supplies are critical power devices for modern-day electronic functionality. From the electrical interconnects to PCB and component protection to heat dissipation and external housing bonding, Henkel materials deliver a comprehensive solution for DC/DC power supply protection and production.

Solutions for Uninterruptible Power Supplies (UPS)

Uninterrupted power supplies (UPS) provide clean, consistent power to protect essential equipment and keep it running in the event standard power supply is disrupted. Among other applications, these devices are relied upon for today’s communication infrastructure and Henkel materials allow UPS designers to save valuable server room real estate by enabling higher power in smaller rack spaces. The use of proven thermal management materials and encapsulation materials protect components from contamination, make high-density designs possible, and help extend device lifetime.

Explore Material Solutions

Our material solutions play a critical role in power supply applications by enabling structural bonding, electrical connection, component protection, and thermal management so that electrical connections are secure, structures are durable, and function is dependable.

Thermal Solutions

Thermal interface material solutions help to protect and provide effective heat control in power electronics PCB designs. Henkel offers a wide range of thermal management materials for power supplies that include the following solutions:

Thermal GAP PAD^®

Henkel’s Thermal GAP PAD^® solutions are designed to meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. They provide an effective thermal interface between metal module housing and components where air gaps and rough surface textures are present.

Thermal Gap Filler and LIQUI-FORM

Thermal Gap Fillers are low stress, liquid materials ideal for interfacing fragile components with high topography to metal module housing. Henkel’s BERGQUIST^® brand of highly engineered, thermally conductive liquids are specifically designed to support optimized dispensing control with excellent thermal and mechanical performance. Dispensed in a liquid state, the material creates virtually zero stress on components.

Phase Change Material

Henkel’s range of phase change materials are ideal for high-performance, solid-state devices, and discrete components by delivering on-demand performance with none of the disadvantages of traditional greases. These materials provide outstanding thermal impedance between components and metal module housing and change from solid to liquid at certain temperatures during device operation. This provides a thin bondline and high reliability without the pump-out that is often experienced with some thermal greases.

LIQUI-BOND

As part of Henkel’s heat-cure liquid adhesive range, LIQUI-BOND provides excellent wet out and thermal performance while also acting as a structural adhesive. It also eliminates the need for clips and other expensive hardware and is ideal for coupling “hot” electronic components mounted to PC boards with an adjacent metal case or heat sink.

SIL-PAD^®

As a world leader of elastomeric thermal interface materials for over 35 years, Henkel offers a full range of SIL-PAD^® solutions to meet the critical needs of the rapidly changing electronic industry. Our portfolio of thermally conductive thin pad insulators continues to be a clean and efficient alternative to mica, ceramics, and grease for a wide range of electronic applications, while providing a robust dielectric interface to help meet safety agency requirements.

BOND-PLY

The BOND-PLY family of materials are thermally conductive and electrically isolating. BOND-PLY is available in a pressure-sensitive adhesive (PSA) or laminating format. BOND-PLY provides for the decoupling of bonded materials with mismatched thermal coefficients of expansion. BOND-PLY provides proven thermal and dielectric performance and eliminates the need for clips and screws to attach discrete components to heat sink or rail.

Protection Solutions

Electrical components are susceptible to many environmental contaminants such as moisture and fluids. Therefore, these components require the use of durable protecting materials. With Henkel’s technical expertise and engineering know-how, our broad range of protecting materials include conformal coatings, encapsulants, low pressure molding materials, potting compounds and underfill materials that provide protection against thermal shock, moisture, and corrosive materials, as well as enhance reliability and mechanical strength and performance.

Conformal coatings provide advanced protection of PCBs from thermal shock, moisture, and corrosive material. Encapsulants are UV and heat curable materials used to protect solder interconnects and sensitive components against mechanical, moisture, and corrosive materials. They are available in transparent formulations for image sensors and glass bonding.

Low pressure molding materials provide an alternative solution to metal and glass housings and provide chemical and moisture resistance along with additional mechanical support. Potting compounds are used to protect solder joints and sensitive components and enhance mechanical strength. These materials provide electrical insulation and improve thermal reliability.
Underfill materials redistribute stress away from the solder interconnects and enhance reliability and mechanical performance.

Bonding Solutions

Secure bonding materials help increase structural durability as well as eliminate the need for additional hardware such as clips and screws. This allows for smaller and lighter electrical device designs. Henkel’s extensive range of bonding solutions include module assembly adhesives, thermally conductive adhesives, and threadlockers that offer the following characteristics:

Module assembly adhesives are designed for bonding module housing assemblies with various surface materials and can also be used for gasketing.
BOND-PLY is a film-based adhesive that offers easy processing by providing a conductive path to remove heat from power components as well as removes the need for additional hardware such as clips or screws.

Thermally conductive adhesives are low stress, liquid materials for interfacing fragile components with high topography to metal module housings. These materials also provide a conductive path to help remove heat from sensitive components.

Threadlockers, as the name implies, are designed for locking and sealing threaded fasteners and are ideal for assembling module housing or attach components to PCBs.