BERGQUIST® SIL PAD® TSP Q2000
Known as Q-Pad® 3
Features and Benefits
Thermally conductive, fiberglass-reinforced, silicone insulator pad suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.
BERGQUIST® SIL PAD TSP Q2000 eliminates problems associated with thermal grease, such as contamination of electronic assemblies and reflow solder baths. BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables it to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.
- Thermal impedance: 0.35°C-in2/W (@50 psi)
- Eliminates processing constraints typically associated with grease
- Easy handling
- Conforms to surface textures
Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | Fiberglass |
| Color | Black |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 180.0 °C |
| Thermal conductivity | 0.2 W/mK |
BERGQUIST® SIL PAD® TSP Q2000
Thermally conductive, fiberglass-reinforced, silicone insulator pad suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.