BERGQUIST® GAP PAD® TGP 10000ULM
Features and Benefits
A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 10000ULM is designed for high performance applications and provides excellent wet-out at the interface characteristics, due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offer high thermal performance at low pressures.
- Thermal conductivity: 10 W/m-K (ASTM D5470)
- Ultra-low modulus design easily conforms and adheres to irregular surfaces
- Low compression stress
- High-compliance
- Supplied with protective liners for ease of use
Documents and Downloads
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Technical Information
| Color | Gray |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 10.0 W/mK |
BERGQUIST® GAP PAD® TGP 10000ULM
A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 10.0W/m-K and ultra low modulus (ULM).