BERGQUIST® GAP PAD® TGP 1300
Conhecido como Gap Pad® 1500S30
Características e Benefícios
BERGQUIST GAP PAD TGP 1300, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material
BERGQUIST® GAP PAD® TGP 1300 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling characteristics.BERGQUIST GAP PAD 1500S30 maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. BERGQUIST GAP PAD 1500S30 features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request
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Documentação Adicional
Informação Técnica
| Capacidade de calor, ASTM E1269 | 1.0 J/g-K |
| Classificação da chama | V-0 |
| Condutividade térmica | 1.3 W/mK |
| Constante dielétrica, @ 1kHz | 5.0 |
| Cor | Rosa-claro |
| Densidade | 1.8 g/cm³ |
| Dureza shore, Thirty second delay value, ASTM D2240 Borracha à granel Shore 00 | 30.0 |
| Espessura padrão | 0.508 - 6.35 mm |
| Resistividade volumétrica | 1×10 Ohm m |
| Temperatura de operação | -60.0 - 200.0 °C |
| Tensão de ruptura dielétrica | 6000.0 Vac |
BERGQUIST® GAP PAD® TGP 1300
BERGQUIST GAP PAD TGP 1300, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material