LOCTITE® ABLESTIK 561KAP
Features and Benefits
LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film
LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561KAP adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces.
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Documents and Downloads
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Technical Information
| Carrier type | Polyimide |
| Cure schedule, @ 125.0 °C | 2.0 hr. |
| Cure type | Heat cure |
| Physical form | Film |
| Shear strength, Aluminium | 1800.0 psi |
LOCTITE® ABLESTIK 561KAP
LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film