LOCTITE® ECCOBOND F 202

Features and Benefits

LOCTITE ECCOBOND F 202, Epoxy, Component assembly, NCA
LOCTITE® ECCOBOND F 202 epoxy adhesive is recommended for photonic applications exposed to high temperatures. This material exhibits low exotherm during its short cure cycle and, for most applications, does not require degassing.
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Technical Information

Cure schedule, Alternate @ 140.0 °C 1.0 hr.
Cure schedule, Recommended @ 125.0 °C 2.0 hr.
Cure type Heat cure
Number of components 2 part
Operating temperature -60.0 - 265.0 °C
Recommended for use with Metal
Shear strength, Aluminium 3000.0 psi
Storage temperature 27.0 °C
Mixed
Viscosity, Mixed @ 25.0 °C 1000.0 mPa·s (cP)